Fine Cut Pad (Yellow)
Fine Cut Pad (Yellow)
- Low stock - 3 items left
- Inventory on the way
- DESCRIPTION
- SHIPPING DETAILS
Koch Chemie Fine Cut Buffing Pads use medium abrasive sponge for removing moderate weathering and scratches using the Fine Cut F6.01 Medium Polishing Compound.
The short height of 23 mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.
- Suitable for polishing
- Removes moderate weathering and scratches
- Suitable for all types of paintwork including scratch resistant finishes
- Durable pad resistant to wear & tear
- 23 mm pad depth creates highest level of stability
- Milling edge ensures extra flexibility for the pads
- Machine washable
- Abrasiveness: 5
- Compression Hardness: 12
At Alpha Details , we strive to provide our customers with the best possible shopping experience. We understand that fast and reliable shipping is an important part of that experience. Therefore, we have partnered with Sendle to ensure that your orders are delivered as quickly and efficiently as possible.
Shipping via Sendle is calculated at checkout for all orders within Australia. Orders are shipped using Sendle and delivery timeframes are estimated to be between 2-7 business days, depending on the delivery location. Please note that delivery times may be affected by factors beyond our control, such as weather conditions and public holidays.
Order Processing Time
We aim to process and ship all orders within 1-2 business days after payment has been received. If there are any delays or issues with your order, we will contact you as soon as possible to provide an update.